Read e-book online Adhesives Technology for Electronic Applications: Materials, PDF

By James J. Licari,Dale W. Swanson

This publication is exclusive in its entire assurance of all features of adhesive expertise for microelectronic units and packaging, from conception to bonding to check tactics. as well as basic functions, comparable to dies, substrate, and lid and chip stack attachments, the publication contains new advancements in anisotropic, electrically conductive, and underfill adhesives. speedy curing tools equivalent to UV, microwave, and moisture (which agree to present environmental and effort requisites) are coated. Over eighty tables and one hundred twenty figures offer a wealth of knowledge on houses, functionality, and reliability. additionally integrated are examples of commercially on hand adhesives, providers, and kit. every one bankruptcy presents accomplished references.

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Adhesives Technology for Electronic Applications: Materials, Processing, Reliability (Materials and Processes for Electronic Applications) by James J. Licari,Dale W. Swanson


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